JPH0713228Y2 - 混成集積回路装置のリードフレーム - Google Patents
混成集積回路装置のリードフレームInfo
- Publication number
- JPH0713228Y2 JPH0713228Y2 JP1988159009U JP15900988U JPH0713228Y2 JP H0713228 Y2 JPH0713228 Y2 JP H0713228Y2 JP 1988159009 U JP1988159009 U JP 1988159009U JP 15900988 U JP15900988 U JP 15900988U JP H0713228 Y2 JPH0713228 Y2 JP H0713228Y2
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- integrated circuit
- hybrid integrated
- circuit device
- hic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 230000000630 rising effect Effects 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 6
- 239000000758 substrate Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
Landscapes
- Lead Frames For Integrated Circuits (AREA)
- Multi-Conductor Connections (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988159009U JPH0713228Y2 (ja) | 1988-12-08 | 1988-12-08 | 混成集積回路装置のリードフレーム |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1988159009U JPH0713228Y2 (ja) | 1988-12-08 | 1988-12-08 | 混成集積回路装置のリードフレーム |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0279059U JPH0279059U (en]) | 1990-06-18 |
JPH0713228Y2 true JPH0713228Y2 (ja) | 1995-03-29 |
Family
ID=31439843
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1988159009U Expired - Lifetime JPH0713228Y2 (ja) | 1988-12-08 | 1988-12-08 | 混成集積回路装置のリードフレーム |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0713228Y2 (en]) |
-
1988
- 1988-12-08 JP JP1988159009U patent/JPH0713228Y2/ja not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
JPH0279059U (en]) | 1990-06-18 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
EXPY | Cancellation because of completion of term |